As semiconductor lithographic masks migrate to smaller and smaller patterns, the process cost of fabricated silicon wafers rises. As a result, rejected wafers represent a significant loss.
Direct Write technology uses high power DPSS UV lasers to recover up to 95% of these losses by allowing manufacturers to directly repair or isolate the damaged portions of a wafer.
The Series 3500 UV model 3520-30 combines the high peak power, short wavelength and superior beam quality required to make such micro-repairs.
As semiconductor lithographic masks migrate to smaller and smaller patterns, the process cost of fabricated silicon wafers rises. As a result, rejected wafers represent a significant loss.